Rozcestník experimentálního vybavení pro fyziku a materiálové vědy
Capacitively coupled dry reactive ion etching – CCP RIE
Capacitively coupled dry reactive ion etching – CCP RIE:
CCP-RIE (type Phantom III) allows etching of various materials (e.g. diamond, silicon, glass, etc.) using gases SF6, CF4, O2, Ar. The system could be used also for surface termination of samples.
Section:
3
Department:
27
Contact person:
Ing. Alexander KROMKA, PhD
Phone number:
220 318 437
E-mail:
Room:
F41
Number:
1